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中國集成電路檢測和測試產業技術創新路線圖 版權信息
- ISBN：9787121360589
- 條形碼：9787121360589 ; 978-7-121-36058-9
- 裝幀：一般膠版紙
- 冊數：暫無
- 重量：暫無
- 所屬分類：>>
中國集成電路檢測和測試產業技術創新路線圖 本書特色
集成電路測試設備與檢測儀器是集成電路產業技術研發及生產中不可缺的核心設備。在我國集成電路發展的這些年中，該領域的發展一直沒有得到應有的重視，全行業發展處于摸索階段，甚至一些領域仍然是空白。隨著工藝技術的快速發展，測試設備/檢測儀器的總投入規模已經達到整個晶圓制造工廠設備總投資規模的30%以上。隨著工藝節點的更新，其技術的需求將面臨更大的挑戰。本書面向中國集成電路測試與檢測產業鏈的技術創新趨勢，在借鑒國際測試技術發展路線圖的同時，以國內檢測與測試產業鏈為主要對象，針對性的提出了國內集成電路測試產業鏈技術創新發展路線。全書共6章，從5個方面分析了國內測試產業實現產業技術鏈創新和趕超國際產業的主要方向，包括集成電路檢測、自動化測試ATE和電力電子測試技術與產品，另外還有測試服務和軍民融合技術；對正在不斷涌現的新領域進行了簡要分析；*后對封裝測試的市場格局發展進行總結，推動我們集成電路產業贏得更快更好的發展。
中國集成電路檢測和測試產業技術創新路線圖 內容簡介
集成電路測試設備與檢測儀器是集成電路產業技術研發及生產中不可缺的核心設備。在我國集成電路發展的這些年中，該領域的發展一直沒有得到應有的重視，全行業發展處于摸索階段，甚至一些領域仍然是空白。隨著工藝技術的快速發展，測試設備/檢測儀器的總投入規模已經達到整個晶圓制造工廠設備總投資規模的30%以上。隨著工藝節點的更新，其技術的需求將面臨更大的挑戰。本書面向中國集成電路測試與檢測產業鏈的技術創新趨勢，在借鑒靠前測試技術發展路線圖的同時，以靠前檢測與測試產業鏈為主要對象，針對性的提出了靠前集成電路測試產業鏈技術創新發展路線。全書共6章，從5個方面分析了靠前測試產業實現產業技術鏈創新和趕超靠前產業的主要方向，包括集成電路檢測、自動化測試ATE和電力電子測試技術與產品，另外還有測試服務和軍民融合技術；對正在不斷涌現的新領域進行了簡要分析；很后對封裝測試的市場格局發展進行總結，推動我們集成電路產業贏得更快更好的發展。
中國集成電路檢測和測試產業技術創新路線圖 目錄
**章 集成電路工藝品質控制檢測技術與產品.........................................1
一、集成電路產業中的工藝品質控制概況··················································1
（一）集成電路產業鏈與工藝品質控制檢測布局································1
（二）工藝品質控制檢測技術和設備發展趨勢····································2
（三）工藝品質控制檢測設備市場整體情況········································4
二、硅制程（前道）中的關鍵工藝品質控制檢測技術與設備··················4
（一）圖形化表面檢測技術與設備························································7
（二）無圖形表面檢測技術與設備······················································20
（三）光刻套刻對準測量技術與設備··················································23
（四）其他分析及檢測技術與設備······················································25
（五）前道制程中的工藝品質控制檢測的整體發展趨勢··················26
三、晶圓級封裝（中道）中的關鍵工藝品質控制檢測技術與設備········29
（一）三維表面形貌測量技術與設備··················································30
（二）自動光學檢測技術與設備（中道）··········································35
（三）無圖形表面檢測技術與設備······················································37
（四）中道制程中的工藝品質控制檢測的整體發展趨勢··················37
四、基板與傳統封裝測試（后道）中的關鍵工藝品質控制檢測技術
與設備····································································································38
（一）自動光學檢測技術與設備（后道）········································· 38
（二）自動X 射線檢測技術與設備···················································· 41
（三）后道制程中的工藝品質控制檢測的整體發展趨勢················· 42
第二章 自動化測試設備技術與產品......................................................... 43
一、芯片/模組測試市場需求及發展趨勢·················································· 43
（一）電源管理類芯片的測試需求及趨勢········································· 47
（二）CIS 芯片的測試需求及趨勢······················································ 47
（三）邏輯/混合信號芯片的測試需求及趨勢···································· 49
（四）存儲器芯片的測試需求及趨勢················································· 52
（五）LCD Driver芯片的測試需求及趨勢········································· 54
二、ATE 自動測試機械手的現狀及發展方向··········································· 57
三、模擬及電源管理芯片ATE 設備發展現狀及趨勢······························ 59
四、邏輯/混合信號ATE 測試系統的發展現狀及趨勢····························· 60
五、存儲器ATE 測試系統的發展現狀及趨勢·········································· 62
六、LCD Driver 測試系統的發展現狀及趨勢··········································· 63
七、其他定制化專用集成電路測試設備發展的方向及趨勢··················· 65
八、SLT 測試技術的特點及行業發展前景··············································· 67
九、指紋芯片/模組的測試發展趨勢·························································· 69
十、MEMS芯片的測試發展趨勢······························································ 71
十一、與芯片可測性設計結合的ATE 設備一體化方案路線·················· 73
第三章 測試服務...................................................................................... 75
一、測試服務——平臺技術······································································· 77
（一）整體技術需求············································································· 77
（二）發展趨勢····················································································· 77
（三）重點方向····················································································· 78
二、測試服務——共性技術······································································· 81
（一）整體技術需求············································································· 81
（二）重點方向····················································································· 82
（三）發展趨勢····················································································· 84
三、測試服務——產品測試解決方案························································84
（一）先進工藝IP 核測試解決方案····················································85
（二）先進封裝測試解決方案······························································87
（三）先進核心產品測試解決方案······················································90
第四章 軍用與民用集成電路測試差異性研究與技術發展....................... 102
一、整體技術需求······················································································102
二、發展趨勢······························································································103
三、重點方向······························································································105
（一）寬溫測試技術············································································105
（二）抗輻照測試技術········································································107
（三）電磁環境效應測試技術···············································
一、集成電路產業中的工藝品質控制概況··················································1
（一）集成電路產業鏈與工藝品質控制檢測布局································1
（二）工藝品質控制檢測技術和設備發展趨勢····································2
（三）工藝品質控制檢測設備市場整體情況········································4
二、硅制程（前道）中的關鍵工藝品質控制檢測技術與設備··················4
（一）圖形化表面檢測技術與設備························································7
（二）無圖形表面檢測技術與設備······················································20
（三）光刻套刻對準測量技術與設備··················································23
（四）其他分析及檢測技術與設備······················································25
（五）前道制程中的工藝品質控制檢測的整體發展趨勢··················26
三、晶圓級封裝（中道）中的關鍵工藝品質控制檢測技術與設備········29
（一）三維表面形貌測量技術與設備··················································30
（二）自動光學檢測技術與設備（中道）··········································35
（三）無圖形表面檢測技術與設備······················································37
（四）中道制程中的工藝品質控制檢測的整體發展趨勢··················37
四、基板與傳統封裝測試（后道）中的關鍵工藝品質控制檢測技術
與設備····································································································38
（一）自動光學檢測技術與設備（后道）········································· 38
（二）自動X 射線檢測技術與設備···················································· 41
（三）后道制程中的工藝品質控制檢測的整體發展趨勢················· 42
第二章 自動化測試設備技術與產品......................................................... 43
一、芯片/模組測試市場需求及發展趨勢·················································· 43
（一）電源管理類芯片的測試需求及趨勢········································· 47
（二）CIS 芯片的測試需求及趨勢······················································ 47
（三）邏輯/混合信號芯片的測試需求及趨勢···································· 49
（四）存儲器芯片的測試需求及趨勢················································· 52
（五）LCD Driver芯片的測試需求及趨勢········································· 54
二、ATE 自動測試機械手的現狀及發展方向··········································· 57
三、模擬及電源管理芯片ATE 設備發展現狀及趨勢······························ 59
四、邏輯/混合信號ATE 測試系統的發展現狀及趨勢····························· 60
五、存儲器ATE 測試系統的發展現狀及趨勢·········································· 62
六、LCD Driver 測試系統的發展現狀及趨勢··········································· 63
七、其他定制化專用集成電路測試設備發展的方向及趨勢··················· 65
八、SLT 測試技術的特點及行業發展前景··············································· 67
九、指紋芯片/模組的測試發展趨勢·························································· 69
十、MEMS芯片的測試發展趨勢······························································ 71
十一、與芯片可測性設計結合的ATE 設備一體化方案路線·················· 73
第三章 測試服務...................................................................................... 75
一、測試服務——平臺技術······································································· 77
（一）整體技術需求············································································· 77
（二）發展趨勢····················································································· 77
（三）重點方向····················································································· 78
二、測試服務——共性技術······································································· 81
（一）整體技術需求············································································· 81
（二）重點方向····················································································· 82
（三）發展趨勢····················································································· 84
三、測試服務——產品測試解決方案························································84
（一）先進工藝IP 核測試解決方案····················································85
（二）先進封裝測試解決方案······························································87
（三）先進核心產品測試解決方案······················································90
第四章 軍用與民用集成電路測試差異性研究與技術發展....................... 102
一、整體技術需求······················································································102
二、發展趨勢······························································································103
三、重點方向······························································································105
（一）寬溫測試技術············································································105
（二）抗輻照測試技術········································································107
（三）電磁環境效應測試技術···············································
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中國集成電路檢測和測試產業技術創新路線圖 作者簡介
集成電路測試儀器與裝備產業技術創新聯盟是在集成電路產業技術創新戰略聯盟領導下，在科技部指導下，于2016年12月24日由我國從事集成電路檢測與測試技術相關的產學研用單位在完全自愿的基礎上發起成立。聯盟秘書處依托中國科學院微電子研究所，遵守各項法規、保障公平、公正、可持續發展，屬于非排他性的、開放的非營利性創新組織。聯盟秉承"開放、協作、分享、共贏”的宗旨，以我國集成電路測試產業未來發展的關鍵技術與重大科學儀器產品需求為牽引，依托聯盟各成員單位的人才、技術和市場資源，加強信息交流共享、開展國內國際合作、整合測試產業資源、突出聯盟整體優勢、提升聯盟成員作用，同時在政府和會員單位之間發揮橋梁和紐帶作用，共同推動我國集成電路測試儀器和裝備的技術創新和產業化，并為國際集成電路測試技術發展做出貢獻。
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