掃一掃
關注中圖網
官方微博
本類五星書更多>
-
>
公路車寶典(ZINN的公路車維修與保養秘籍)
-
>
晶體管電路設計(下)
-
>
基于個性化設計策略的智能交通系統關鍵技術
-
>
花樣百出:貴州少數民族圖案填色
-
>
山東教育出版社有限公司技術轉移與技術創新歷史叢書中國高等技術教育的蘇化(1949—1961)以北京地區為中心
-
>
鐵路機車概要.交流傳動內燃.電力機車
-
>
利維坦的道德困境:早期現代政治哲學的問題與脈絡
買過本商品的人還買了
集成電路封裝材料的表征 版權信息
- ISBN：9787560342825
- 條形碼：9787560342825 ; 978-7-5603-4282-5
- 裝幀：一般膠版紙
- 冊數：暫無
- 重量：暫無
- 所屬分類：>>
集成電路封裝材料的表征 本書特色
《集成電路封裝材料的表征(英文)》的主要內容包括： foreword；preface to the reissue of the materials characterization series xiii；preface to series xiv；preface to the reissue of integrated circuit packaging materials xv；preface xvi；contributors xix等。
集成電路封裝材料的表征 內容簡介
相關領域的教學、研究、技術人員以及研究生和高年級本科生參考書。
集成電路封裝材料的表征 目錄
foreword xi
preface to the reissue of the materials characterization series xiii
preface to series xiv
preface to the reissue of integrated circuit packaging materials xv
preface xvi
contributors xix
ic package reliability testing
mold compound adhesion and strength
mechanical stress in ic packages
moisture sensitmty and delamination
thermal management
electrical performance of ic packages
solderability of integrated circuits
hermeticity and joining in ceramic ic packages
advanced interconnect technology
appendix： technique summaries
preface to the reissue of the materials characterization series xiii
preface to series xiv
preface to the reissue of integrated circuit packaging materials xv
preface xvi
contributors xix
ic package reliability testing
mold compound adhesion and strength
mechanical stress in ic packages
moisture sensitmty and delamination
thermal management
electrical performance of ic packages
solderability of integrated circuits
hermeticity and joining in ceramic ic packages
advanced interconnect technology
appendix： technique summaries
展開全部
集成電路封裝材料的表征 作者簡介
Thomas M. Moore and Robert G. McKennaForeword by Walter H. Schroen， TI FELLOWCharacterization of Integrated Circuit Packaging Materials deals with the systemsof materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniquesappropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technologicalproblems of IC packages. This book discusses issues which affect a varietyof package types， including plastic surface—mount packages， hermetic packages， and advanced designs such as flip—chip， chip—on—board， and multi—chipmodels.
書友推薦
- >
小考拉的故事-套裝共3冊
- >
月亮與六便士
- >
名家帶你讀魯迅:朝花夕拾
- >
中國歷史的瞬間
- >
莉莉和章魚
- >
我從未如此眷戀人間
- >
大紅狗在馬戲團-大紅狗克里弗-助人
- >
二體千字文
本類暢銷
